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| MBRS540T3 Preferred Device Surface Mount Schottky Power Rectifier The MBRS540T3 employs the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. Features http://onsemi.com * * * * * * Pb-Free Package is Available Small Compact Surface Mountable Package with J-Bend Leads Rectangular Package for Automated Handling Highly Stable Oxide Passivated Junction Excellent Ability to Withstand Reverse Avalanche Energy Transients Guardring for Stress Protection SCHOTTKY BARRIER RECTIFIER 5.0 AMPERES 40 VOLTS MARKING DIAGRAM SMC CASE 403 PLASTIC Mechanical Characteristics * Case: Epoxy, Molded, Epoxy Meets UL 94 V-0 @ 0.125 in * Weight: 217 mg (approximately) * Finish: All External Surfaces Corrosion Resistant and Terminal * Lead and Mounting Surface Temperature for Soldering Purposes: * * * 260C Max. for 10 Seconds Polarity: Notch in Plastic Body Indicates Cathode Lead ESD Rating: Machine Model, C (> 400 V) Human Body Model, 3B (> 8000 V) Device Meets MSL 1 Requirements Leads are Readily Solderable B540 Y W YWW B540 = Specific Device Code = Year = Work Week ORDERING INFORMATION Device MBRS540T3 Package SMC SMC (Pb-Free) Shipping 2500/Tape & Reel 2500/Tape & Reel MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TC = 105C) Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 KHz, TC = 80C) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Storage Temperature Range Operating Junction Temperature Voltage Rate of Change (Rated VR) Symbol VRRM VRWM VR IF(AV) IFRM Value 40 Unit V MBRS540T3G 5 10 A A For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. IFSM 190 A Tstg TJ dv/dt -65 to +150 -65 to +125 10,000 C C V/ms Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. (c) Semiconductor Components Industries, LLC, 2004 1 September, 2004 - Rev. 3 Publication Order Number: MBRS540T3/D MBRS540T3 THERMAL CHARACTERISTICS Characteristic Thermal Resistance - Junction-to-Lead (Note 1) Thermal Resistance - Junction-to-Ambient (Note 1) Symbol RqJL RqJA Value 12 111 Unit C/W ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 2) Maximum Instantaneous Reverse Current (Note 2) (iF = 5.0 A, TC= 25C) (Rated dc Voltage, TC = 25C) (Rated dc Voltage, TC = 100C) VF iR 0.50 0.3 15 V mA 1. Rating applies when surface mounted on the minimum pad size recommended. 2. Pulse Test: Pulse Width 300 ms, Duty Cycle 2.0%. TYPICAL CHARACTERISTICS 10 IF, INSTANTANEOUS FORWARD CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 10 1 TJ = 125C 1 TJ = 125C TJ = 100C 0.1 0.10 TJ = 100C 0.20 TJ = 25C 0.30 0.40 TJ = -55C 0.50 0.60 0.1 0.10 TJ = 25C 0.20 0.30 0.40 TJ = -55C 0.50 0.60 0.70 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 100E-3 IR, REVERSE CURRENT (AMPS) 10E-3 1E-3 TJ = 125C TJ = 100C IR, MAXIMUM REVERSE CURRENT (AMPS) 100E-3 TJ = 125C 10E-3 TJ = 100C 1E-3 TJ = 25C TJ = -55C 10E-6 100E-6 10E-6 1E-6 TJ = 25C TJ = -55C 100E-6 100E-9 10E-9 1E-9 0 100E-12 10 20 30 VR, REVERSE VOLTAGE (VOLTS) 40 1E-6 0 10 20 30 VR, REVERSE VOLTAGE (VOLTS) 40 Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current http://onsemi.com 2 MBRS540T3 TYPICAL CHARACTERISTICS 9 8 IO, AVERAGE FORWARD CURRENT (AMPS) 7 6 5 4 3 2 1 0 25 SQUARE WAVE Ipk/IO = p Ipk/IO = 5 Ipk/IO = 10 Ipk/IO = 20 dc freq = 20 kHz PFO, AVERAGE POWER DISSIPATION (WATTS) 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 0 1 2 3 Ipk/IO = p Ipk/IO = 5 Ipk/IO = 10 Ipk/IO = 20 4 5 6 7 8 9 IO, AVERAGE FORWARD CURRENT (AMPS) SQUARE WAVE dc 45 65 85 105 125 145 TL, LEAD TEMPERATURE (C) Figure 5. Current Derating TJ, DERATED OPERATING TEMPERATURE (C) Figure 6. Forward Power Dissipation 1000 TJ = 25 C 125 RqJA = 12 C/W 115 105 95 85 75 65 55 0 5 RqJA = 136 C/W 10 15 20 25 30 35 40 VR, DC REVERSE VOLTAGE (VOLTS) 45 RqJA = 81 C/W RqJA = 111 C/W RqJA = 47 C/W C, CAPACITANCE (pF) 100 0 5 10 15 20 25 30 VR, REVERSE VOLTAGE (VOLTS) 35 40 Figure 7. Capacitance Figure 8. Typical Operating Temperature Derating http://onsemi.com 3 MBRS540T3 r(t), TRANSIENT THERMAL RESPONSE (C/W) 1000 100 D = 0.5 0.2 0.1 P(pk) Test Type > min pad 1 oz RqJC = min pad 1 oz C/W 10 0.05 0.02 1 0.01 SINGLE PULSE 0.0001 0.001 0.01 0.1 t, TIME (s) 1 0.1 0.00001 t2 DUTY CYCLE, D = t1/t2 10 100 1000 t1 Figure 9. Thermal Response - MBRS540T3 on min pad r(t), TRANSIENT THERMAL RESPONSE (C/W) 100 D = 0.5 0.2 10 0.1 0.05 1 0.02 0.01 SINGLE PULSE 0.0001 0.001 0.01 0.1 t, TIME (s) 1 t2 DUTY CYCLE, D = t1/t2 10 100 1000 t1 P(pk) Test Type > min pad 1 oz RqJC = min pad 1 oz C/W 0.1 0.00001 Figure 10. Thermal Response - MBRS540T3 on 1" pad http://onsemi.com 4 MBRS540T3 PACKAGE DIMENSIONS SMC CASE 403-03 ISSUE D S A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. 4. 403-01 THRU -02 OBSOLETE, NEW STANDARD 403-03. D B C J H INCHES DIM MIN MAX A 0.260 0.280 B 0.220 0.240 C 0.075 0.095 D 0.115 0.121 H 0.0020 0.0060 J 0.006 0.012 K 0.030 0.050 P 0.020 REF S 0.305 0.320 MILLIMETERS MIN MAX 6.60 7.11 5.59 6.10 1.90 2.41 2.92 3.07 0.051 0.152 0.15 0.30 0.76 1.27 0.51 REF 7.75 8.13 K P SOLDERING FOOTPRINT* 4.343 0.171 3.810 0.150 2.794 0.110 SCALE 4:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 MBRS540T3 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 6 MBRS540T3/D |
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